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In granular dry ice cleaning medium, by compressed air to dry ice particles in high speed spray to the cleaning surfaces, make clean the dirt on the surface of the frozen to embrittlement and burst, dry ice particles by osmosis knock-on effect between dirt and base material, then sublimation, instantaneous volume increases 800 times, forcing the dirt away from the base material, achieve the purpose of cleaning.
Controlled temperature auxiliary gas, object surface no condensation.
Removal of foreign particles at micro and nano levels.
Micro-nano particles dry ice, small damage.
No waste water, waste liquid generated.
No additional drying process, low power consumption.
Suitable for complex shapes.
Dry ice particles diameter: 0.5 1000 microns is adjustable.
Optional online detection, graphical cleaning and other functions.
Class | No. | Cleaning method | Foreign body particle removal | Membrane layer removal | Damage to the object | Drying process | Environmental pollution | Problem |
Wet | 1 | Water | General | Worse | Genera | Need | Bad | Re-attachment of water membrane, metal element residues |
2 | Organic solvent | General | Better | Larger | Need | Large | Organic solvent then attached, solvent after treatment | |
Dry | 3 | Nano-dry ice | Fine | Easy | Lower | - | - | Small cleaning area |
4 | Ultrasonic wave | General | Difficult | General | - | - | Solid foreign bodies, fine particles difficult to remove | |
5 | Air | General | Difficult | General | - | - | Solid foreign bodies, fine particles difficult to remove | |
| 6 | Atmospheric plasma | Easy | Difficult | Larger | - | - | Poor cleaning ability |
| Model | Semiconductor cleaning machine WMGB01 |
| Outline dimension | 450×500×300 |
| Weight | 20Kg |
| Power supply | 220V 50Hz single phase |
| Power | 2kW |
CO2 injection system | |
| CO2 | Liquid state |
| CO2 pressure | ≥5.5MPa |
| Nozzle specification | 0.1mm~4mm |
| CO2 consumption | 50~200g/min |
CO2 constant temperature system | |
| Medium | - |
| Capacity | - |
Temperature regulation range | - |
CO2 pressurization system | |
Driving medium | - |
| Driving air pressure | - |
| Boost ratio | - |
Boost volume | - |
| CDA auxiliary system | |
| CDA gas | Compressed air/nitrogen |
| CDA pressure | 0.1~0.8MPa |
CDA temperature regulation | Optional |
| Project | Appearance | Hole cleaning effect (EDX test residue） | Holecleaning effect （Aluminum layer thickness, SEM detection of aluminum layer） | Effect |
Dry ice before cleaning | Surface whitening | Residue in hole | Aluminum layer 4.5um | —————— |
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|  | ||
After dry ice cleaning | Clean surface | No residue in the hole | Aluminum layer 4.3um | ①Ideal cleaning effect; ②No corrosion to aluminum layer; ③Binding force5.2N/cm. |
 |
|  | ||
After high-pressure water gun cleaning | Clean surface | Inside the hole are copper chips | Aluminum layer 4.5um | ①Ideal cleaning effect; ②Inside the hole are copper chips; ③Binding force 4.5N/cm. |
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|  |
| Project | Hole cleaning effect (EDX detection residue) | |||
Dry ice before cleaning | 1 | 2 | 3 | Elemental analysis |
 |  |  |  | |
| After dry ice cleaning | 1 | 2 | 3 | Elemental analysis |
 |  |  |  | |
After the high-pressure water gun cleaning | 1 | 2 | 3 | Elemental analysis （Include Cu） |
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