Electrospinning Machine| Dual Deprotonation-Enabled 3D Hydrogen-Bonding Networks in Aramid Nanofiber Films Toward Extraordinary Mechanical Strength and Ultralow Thermal Conductivity

Challenge: Developing thin materials that simultaneously possess high mechanical strength and low thermal conductivity is fundamentally challenging due to the inherent trade-off between structural reinforcement and thermal insulation.

Approach: A team led by Academician Jiang Lei, Professor Liu Mingjie, and Associate Professor Lu Xianyong from Beihang University proposed a "double deprotonation" strategy, constructing a 3D hydrogen bond network between para-aramid nanofibers (pANFs) and PMIA molecules to design high-performance composite films (pAMNFs).

Innovation 1: The pure organic composite film exhibits a tensile strength of 202.5 MPa, toughness of 24.1 MJ m−3, thermal conductivity of 0.0824 W m−1K−1, excellent thermal stability (decomposition temperature of 415.4°C), and water resistance.

Innovation 2: These films retain over 95% of their mechanical strength across a wide temperature range (−30°C to 150°C), surpassing intrinsic aramid nanofiber films (which retain only 68% under similar conditions). This superior performance stems from the robust interfacial 3D hydrogen bond network, enabling efficient load transfer and thermal regulation between nanofibers and surface polymers.

DOI: https://doi.org/10.1002/adfm.202509681